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The Intel Xeon Gold 5317 is a 3rd Gen Intel Xeon Scalable processor based on the Ice Lake-SP microarchitecture. It provides 12 physical cores and 24 logical threads through Intel Hyper-Threading Technology, with a base frequency of 3.0 GHz and a maximum turbo frequency of 4.4 GHz. The processor includes 18 MB of shared L3 cache and carries a rated thermal design power of 150 W. Designed for the LGA4189 socket, it supports both single-socket and dual-socket server configurations. The integrated memory controller handles 8 channels of DDR4 memory at speeds up to 3200 MT/s, and the processor supports PCIe 4.0 for high-bandwidth peripheral connectivity. This CPU is intended for industrial clients and enterprise customers deploying virtualization platforms, medium-scale databases, hyper-converged infrastructure, and core business application systems.
Model | Intel Xeon Gold 5317 |
|---|---|
Generation | 3rd Gen Xeon Scalable (Ice Lake-SP) |
Core / Thread | 12 Core / 24 Thread |
Base Frequency | 3.0 GHz |
Max Turbo Frequency | 4.4 GHz |
L3 Cache | 18 MB |
Socket | LGA4189 |
Configuration | 1-Socket / 2-Socket |
Memory Support | 8 Channel DDR4, up to 3200 MT/s |
PCIe Version | PCIe 4.0 |
TDP | 150 W |
Security Tech | Intel SGX, Intel Crypto Acceleration |
Compliance | RoHS Compliant |
The 12-core / 24-thread configuration supports concurrent workloads including virtual machine consolidation and multi-tenant hosting environments. The 18 MB L3 cache reduces average memory access latency for frequently referenced data sets, which benefits online transaction processing and in-memory caching services.
The processor operates at a 3.0 GHz base frequency, and Intel Turbo Boost Technology raises the clock speed to 4.4 GHz on cores that meet power and thermal criteria. The 150 W TDP falls within the thermal envelope of standard rack server air-cooling solutions, allowing the CPU to be deployed in existing LGA4189 chassis without liquid cooling modifications.
The 8-channel DDR4 memory controller supports registered ECC modules at speeds up to 3200 MT/s. This memory bandwidth supports data analytics workloads and virtual desktop infrastructure deployments where multiple concurrent user sessions require consistent throughput.
PCIe 4.0 delivers doubled per-lane bandwidth compared with PCIe 3.0, supporting higher throughput for NVMe storage arrays, 100 GbE network adapters, and GPU accelerator cards used in compute-intensive enterprise environments.
The 12-core / 24-thread layout supports concurrent virtual machine instances on shared cloud hosts and private cloud platforms. Dual-socket compatibility allows a single server node to scale to 24 cores and 48 threads for higher VM consolidation ratios.
The 18 MB L3 cache and 8-channel DDR4 memory subsystem support MySQL, PostgreSQL, and comparable relational database workloads. The balance between core count and memory bandwidth suits transaction systems operated by small and medium organizations.
The Xeon Gold 5317 runs ERP, OA, and supply chain management systems. The 4.4 GHz maximum turbo frequency addresses latency-sensitive application logic, while the 24-thread capacity handles concurrent user sessions during peak operating hours.
The processor supports offline batch computing, statistical reporting, and medium-volume data processing tasks. The 8-channel memory interface and PCIe 4.0 storage connectivity reduce I/O bottlenecks for scheduled data workloads.
The Intel Xeon Gold 5317 uses the LGA4189 socket, which is compatible with motherboards designed for 3rd Gen Intel Xeon Scalable processors.
Yes, the processor supports both 1-socket and 2-socket server configurations. A dual-socket node provides a combined 24 cores and 48 threads.
The integrated memory controller supports 8-channel DDR4 memory at speeds up to 3200 MT/s.
The processor includes Intel Software Guard Extensions (SGX) for hardware-assisted secure enclaves and Intel Crypto Acceleration for accelerated encryption operations.
Yes, the processor is RoHS compliant, meeting the restriction of hazardous substances directive for electronic components.
